UV-off Label
Features
UV-off Label, before is exposed on the UV irradiation, the products have high peeling
force (>2Kg/25mm), and can protect it from the production process.
After is exposed in300~500mJ/cm²of the UV irradiation, the peeling force of UV-off film reduces sharply to less than 20g/25mm. Easy peel off and w/o adhesive residue on acting surface.
Application
Applications such as LED die-cutting, IC-board cutting, battery terminal die-cutting, PCB cutting and Wafer grinding etc.
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